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UV-tape for wafer dicing

UV-tape for wafer dicing

Product Name UV-tape for wafer dicing
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Product Description

UV-Tape for Wafer Dicing Main Feature:

1.High adhesion during wafer dicing and low adhesion (non-sticky) after exposed to UV light to make easily chip picked

   up and avoids chip flying, no adhesive residue.

2.Be non-sticky quickly when exposed to UV light.

3.Full dicing of wafer, no wafer particle wastage, Less wafer fragment.

4.High adhesion to make no shift and falling during chip picked &placed.

5.Excellent wafer dicing and chip pick &place.

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