China Shenzhen KHJ Technology Co., Ltd company news

From March 20-22, 2024, productronica China 2024, an event for the electronic equipment industry, was held at the Shanghai New International Expo Center (SNIEC). Excellent enterprises and exhibitors from all over the world gathered here to explore new opportunities in industry segments. This year's exhibition attracted industry insiders from many countries and regions around the world, more than 900 enterprises gathered in Shanghai, for the electronic equipment industry presented a display of exchanges and trade and cooperation feast, to explore the domestic and international double-cycle development pattern of the electronic equipment industry under the development of new ideas. As a leading manufacturer of ESD adhesive tapes, Cohonk is a regular visitor to the Electronic Equipment Expo. At this exhibition, Cohonkian shined with its products, in addition to SMT splicing tape, SMT splicing tools, PI high temperature tape, PET high temperature tape and other veteran products. Also brought non-silicon high temperature tape, semiconductor packaging tape, pyrolytic adhesive tape, UV adhesive tape and many other star products and QFN packaging tape solutions and BGA packaging tape solutions debut.   Cohonkian this launch of QFN packaging tape solutions and BGA packaging tape solutions and other innovative solutions, with efficient and excellent R & D and production capacity, to protect the key technologies, independent research and development, dedicated to semiconductor chip packaging fixed, ceramic capacitors, PCB board cutting and positioning, and other processes such as the role of the protection of the process. At the exhibition site, Cohongjian attracted many people in the industry to stop and communicate with each other to discuss in detail and share the industry development trend, the direction of ESD tape development and application advantages, we will continue to adhere to independent innovation, strengthen the ability of technological innovation, technological breakthroughs as the goal of contributing to the development of the industry. In the future, Cohongjian will continue to be committed to research and development of high-quality ESD tape products and industry application solutions, and constantly broaden the scope of application of ESD tape products.

From April 13th to 15th, 2023, the 3-day 2023 Munich Shanghai Electronic Production Equipment Exhibition will be held in Shanghai New International Expo Center!     As a display and exchange platform for the electronics manufacturing industry, the 2023 Munich Shanghai Electronics Production Equipment Exhibition has a scale of 73,000 square meters, attracting 800+ industry companies to participate in the exhibition, covering multiple fields such as Industry 4.0, automotive electronics, and smart factories. One-stop display Global cutting-edge technologies and products in the entire industrial chain of intelligent manufacturing and electronic innovation.     KHJ, as a global electronic ESD tape manufacturer, was invited to participate in the exhibition, bringing a variety of electronic process auxiliary material solutions and special packaging tape solutions to the exhibition.       KHJ's ESD special tape and SMT consumables are widely used in the industrial and electronic fields, such as anti-static high-temperature tape, semiconductor packaging tape, UV adhesive tape, thermal debonding tape, SMT splicing tape, SMT splicing tools, etc. The products are used in semiconductor manufacturing, 5G optical communication, optoelectronic display, precision electronics and other industries.     KHJ's ESD special tape and SMT consumables are widely used in the industrial and electronic fields, such as anti-static high-temperature tape, semiconductor packaging tape, UV adhesive tape, thermal debonding tape, SMT splicing tape, SMT splicing tools, etc. The products are used in semiconductor manufacturing, 5G optical communication, optoelectronic display, precision electronics and other industries.     Automation is realized in various manufacturing processes of electronic products, which saves manpower, reduces costs and increases efficiency, and improves industrial production efficiency. On the first day of the exhibition, the booth of Kehongjian was full of people, attracting many domestic and foreign exhibitors and professionals to come to consult and understand.     UV adhesive tape is an anti-static UV tape with high initial viscosity. After UV irradiation, the adhesive surface viscosity is greatly reduced, and it can be easily peeled off without adhesive residue. It can be applied to various silicon packages, components, ceramic capacitors, and PCB board cutting and positioning protection.     In addition, there is KHJ Technology's electronic manufacturing process auxiliary material solution. From before loading to delivery and storage, Kehongjian can satisfy customers with the auxiliary materials and consumables required for each step.     As a powerful manufacturer of ESD tapes in the global electronics manufacturing industry and a pioneer in SMT splicing, KHJ has continued to innovate, and has adhered to the four core concepts of service, quality, delivery, and cost for 24 years to meet customer needs. We will take the mission of providing more stable auxiliary materials and consumables for industrial production and electronic manufacturing. We will not forget our original intention and forge ahead.

As a professional manufacturer in the field of industrial adhesive tape, KHJ participated in this exhibition with its subsidiary Olecosi. The main products exhibited by Kehongjian this time include anti-static high-temperature tape, PI high-temperature double-sided tape, non-silicon high-temperature resistant Adhesive tapes, UV adhesive tapes, pyrolytic adhesive tapes, anti-static sticky paper rolls and other products attracted many audiences during the exhibition;   Olecos display machines are mainly Feida, double-sided desktop labeling machine, intelligent feeder, soft track labeling machine, upper and lower plate machine, gold finger glue machine and other equipment. The combination of machine and tape realizes intelligent labeling Labeling, gluing, and gluing for enterprises to realize an integrated service plan. From March 29 to April 1, 2023, ITES Shenzhen International Industrial Manufacturing Technology and Equipment Exhibition and Alibaba 1688 Industrial Purchasing Festival (abbreviation: ITES Shenzhen Industrial Exhibition) kicked off at Shenzhen International Convention and Exhibition Center (Bao'an).

NEPCON ASIA electronic production equipment and microelectronics industry exhibition was held in shenzhen convention and exhibition center from August 28 to 30, with an exhibition area of 60,000 square meters, making it the largest NEPCON exhibition in history. Six exhibitions integrates together, efforts to build electronic manufacturing industry connectivity platform. As one of the world's top quality electronics manufacturers,NEPCON ASIA has attracted more than 800 exhibitors from 38 countries and regions and 60,000 buyers. Thousands of international buyers are invited to the fair to fully tap the purchasing power of overseas markets.     As a company with 20 years experience in industrial adhesive tape and SMT anti-static materials r&d, production and sales in the integration of national high-tech enterprises, Our Shenzhen KHJ Technology Co.,Ltd (booth No. : 1 IK07) displayed our latest research and development SMT splice trolley with two pliers, biodegradable packing tape, high performance industrial tape products and successfully received many valuation clients from this exhibtion.     The three-day exhibition has been a perfect curtain call. KHJ will keep on pursuing perfect product quality to serve our customers.   This exhibition further expands our popularity and influence in the same industry, and at the same time, it also further understands the product characteristics of advanced companies in order to improve our product structure and advantages. In addition, China's electronics industry is in the process of accelerating structural adjustment and kinetic energy conversion. The technology of the traditional electronics manufacturing industry is constantly upgrading, and the industry is becoming more high-end. A large number of innovative enterprises will emerge in China, and technology and applications are leading in the world. KHJ uses the atmosphere of this exhibition to speed up the pace of research and development, and manufacture more high-quality auxiliary products for the electronics manufacturing industry, making contributions to Kehongjian people for smart factories, intelligent manufacturing, and Chinese forces in the future, and creating more excellent services. For the majority of users.     Address: Add:KHJ industrial park, Building 1, Chuangxin industrial zone, Xintian community, Guanlan,Longhua new district, Shenzhen, China 518110 Tel: 0755-82949965 Fax: 0755-82949800 E-mail: marketing@khj.cn

NEPCON South China 2018 will be held on Aug.28-30th at Shenzhen Convention & Exhibition Center. This exhibition will mainly display SMT technology and equipment, welding equipment and materials, testing and measurement, electronic manufacturing automation equipment and other related products. The exhibition will attract 650 brands from 22 countries and regions, over 50,000 professional audiences to visit and negotiate, and more than 10 high-quality and high-level technical seminars. KHJ will display a series of products included: Anti-static Tape, Anti-static Protective Film, SMT splice tape & tool, Industrial Cleaning Wiper etc.   We sincerely invite you to visit us at our Booth No: 1K07.

The 18th Thailand International Exhibition on Assembly, Measurement and Testing Technologies for Electronics Manufacturing will be held at the BITEC exhibition center in banna, Thailand on June 20~23rd,2018. NEPCON Thailand is the largest and most professional international electronics show, covers all the electronics manufacturing industry products, such as SMT equipment products and materials, PCB manufacturing services and materials, electronic components, automation equipment, etc.   Shenzhen KHJ Technology co., LTD., established in 1999, engaged in R&D ,manufacturing and marketing of ESD adhesive products ,with years experience in this field ,KHJ has achieved a number of patents & core technology ,we offer customized adhesive solution to meet customer’s special requirements. KHJ has cooperated with hundreds of electronic manufacturing factories worldwide for 18years on the consumables for SMT /DIP product assemble .   The exhibition, we will display a series of products, such as antistatic adhesive tape, double-sided adhesive tape, protective film , masking tape, sticky roll tape,heat release tape ,SMT splice tool and stencil clean rolls etc. We invite global partners to visit our booth ,exchange views on the future development of the industry.Welcome to visit our booth during the show.

NEPCON China 2015 will be held at Shanghai World EXPO Exhibition & Convention Center from Apr. 21 to Apr. 23 , 2015. The event is one of the biggest and longest standing trading and sourcin.   NEPCON China 2015 will be held at Shanghai World EXPO Exhibition & Convention Center from Apr. 21 to Apr. 23 , 2015. The event is one of the biggest and longest standing trading and sourcing platform in Asia featuring all major brands in the electronics manufacturing world. The exhibition will cover a floor area of 25,000 sqm; bring together over 500 leading companies from 22 countries and regions and 21,000 industry leaders & trade professionals.   The Electronics Manufacturing Automation (EMA) Pavilion to be debuted at NEPCON China 2015 will showcase the most advanced industrial automation technologies and products in the electronics manufacturing industry. It is the only dedicated trade and purchasing platform in China to feature automation solutions for both electronics manufacturers and electronics manufacturing equipment vendors.

To be one of the most important trade events for South China’s SMT industry, NEPCON South China, brings together professionals, buyers and decision makers from the SMT trade and gives them a unique platform on which to get more sales leads and collect market information. The show gives every link along the industry chain an all-in-one innovative solution from components to test & measurement and subcontracting services. The exhibition fuels industry development, enhances production capabilities and boosts sales.   30,000 square meters of exhibition area, 500 exhibitors From 22 countries and regions.  

Semiconductor package   Semiconductor packaging refers to a multi-process, so that the chip can meet the design requirements with independent electrical properties of the process. Packaging process is: from the wafer before the process of wafers through the wafer scribing process, was cut into small grains, and then cut the grains with a solid crystal machine in accordance with the requirements of fixed in the corresponding lead frame in the oven with nitrogen curing, and then use the wire bonding machine will be ultra-fine metal wire bonding pads to connect to the substrate pins, and constitutes the required circuitry; and then the use of molding machine will be independent of the wafer encapsulation with epoxy resin package To encapsulate the protection, this is the semiconductor packaging process. In the package after a series of operations, for finished product testing, and finally into the warehouse shipments.   Application of adhesive film in the packaging process   Semiconductor packaging process, packaging before the wafer cutting and packaging after the substrate cutting, is the entire packaging process is indispensable to the important process, cutting quality directly affects customer satisfaction and the company's benefits, cutting process affects the quality of a number of factors: cutter, cutting parameters, cutting blade, surfactant, coolant, film, etc., has been analyzed in front of the blade, process, cooling water in the cutting Application in cutting process.   Blue film, also known as electronic grade adhesive tape, is mainly used for the protection of glass, aluminum plate, steel plate, because of its cost-effective and suitable for chip cutting, the back was introduced for chip cutting, and is now one of the mainstream wafer cutting tapes for domestic wafer cutting.   Common Abnormalities and Handling Methods In the encapsulation cutting process, often encounter some cutting-related quality problems, caused by many reasons, improper selection of the film will also cause quality problems, common anomalies are: back chipping, flying material, wire drawing, residual adhesive, bubbles, staining. Here mainly from the perspective of the film to analyze the common abnormalities and the corresponding treatment.   Residual glue: 1.DB BLT deviation 2.bad conductivity cause: 1.film expiration 2.adhesive layer off prescription: 1.choose the right adhesive film Fly hopper: 1. hit the knife 2. scratch the product cause: 1. big bubbles, dirty 2. low viscosity of the film prescription: 1. film in accordance with the norms of operation 2. extend the baking temperature and time.   Backfiring: 1. affect the stability of the product cause: 1. slight displacement of the chip 2. blade passivation prescription: 1. choose self-sharpening better blade 2. extend the baking time.   Excessive stickiness: 1.DB fetching difficulty 2.Impact on UPH cause: 1.Film baking temperature and time is too long 2.Film storage time is too long prescription: 1.Replacement of adhesive film with low viscosity 2.Reduction of baking time.

Here is the usage method of UV tape:   Prepare the Surface: Ensure that the surface to be bonded is clean, dry, and smooth. Remove any oil, dust, or other debris to ensure proper adhesion of the tape. Cut the Tape: Using scissors or cutting tools, cut the UV tape to the desired size and shape.   Apply the Tape: Gently apply the cut UV tape onto the surface to be bonded. Ensure that the tape adheres fully to the surface, avoiding the formation of bubbles or gaps.   Exposure to UV Light: UV tape requires exposure to ultraviolet (UV) light to cure. Use a UV lamp or other UV light source to expose the applied tape. Determine the exposure time and distance based on the thickness of the tape and the required curing time. Typically, exposure for several seconds to minutes is sufficient for curing UV tape.   Check Curing: After exposure to UV light, check if the UV tape has cured properly. Cured tape should become firm and resistant to movement. If further curing is needed, continue to expose the tape to UV light.   Remove Excess Tape: If there is any excess or squeezed-out tape during application, use a scraper or other tool to remove it.   Post-cure Handling: Once the UV tape is fully cured, you can proceed with further processing, such as trimming edges or applying paint.   Note: Handle UV light sources with care to avoid direct exposure to skin and eyes. Additionally, ensure safe use of UV light sources to prevent any potential hazards.

The characteristics of scissors used for splicing tapes include: Precision Cutting: These scissors are designed to provide precise and clean cuts on carrier tapes without causing damage to the components or tape structure. Sharp Blades: The blades of splicing tape scissors are typically very sharp, allowing for smooth and effortless cutting of carrier tapes and splice tapes.   Fine Tip: Splicing tape scissors often have a fine tip that enables precise cutting in tight spaces, such as between components on the carrier tape.   Durable Construction: They are made of durable materials such as stainless steel to withstand repeated use in industrial environments without dulling or wearing out quickly.   Comfortable Grip: Ergonomic handles with a comfortable grip are essential for reducing hand fatigue during extended use.   Non-Stick Coating: Some splicing tape scissors may feature a non-stick coating on the blades to prevent adhesive residue from building up and interfering with cutting performance. Safety Features: Safety features such as blade covers or locking mechanisms may be included to prevent accidental cuts and injuries when not in use.   Overall, splicing tape scissors are specifically designed to meet the unique requirements of cutting carrier tapes and splice tapes with precision, efficiency, and safety in mind.

Proper Alignment: Ensure that the splice tape is aligned correctly with the carrier tape. Misalignment can lead to feeding issues or damage to components.     Correct Splicing Technique: Use the appropriate technique to join the carrier tape sections securely with the splice tape. Improper splicing may result in tape jams or component misfeeds.     Tape Tension: Maintain proper tension on the carrier tape and splice tape during the splicing process. Excessive tension can cause tape breakage, while insufficient tension may result in loose splices.   Avoid Contamination: Keep the splice area clean and free from debris to prevent contamination of the tape and components. Contaminants can interfere with the feeding mechanism and affect the reliability of the splice.   Regular Inspection: Periodically inspect the spliced sections for any signs of damage or irregularities. Replace the splice tape if it shows signs of wear or degradation to ensure smooth operation.   Training: Ensure that personnel involved in the splicing process are adequately trained in the proper techniques and safety procedures. This can help prevent errors and minimize the risk of accidents during tape handling.   By following these precautions, you can optimize the use of splice tape in feeder reel applications and minimize the risk of issues during the component placement process.