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products details

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Semiconductor Packaing Tape
Created with Pixso.

Sputter Masking Tape

Sputter Masking Tape

Brand Name: khj
Model Number: E1-IH803
MOQ: 100
Payment Terms: L/C, D/A, D/P, T/T
Detail Information
Place of Origin:
China
Certification:
TDS ROHs
Bacjing:
PI
Heat Resistant:
260℃
Peel Strength (g/inch):
≥400
Product Description

 

Sputter Masking Tape Features

 

· After UV light, it is easy to peel off, with a soft buffer layer;


· Better conformability and heat resistance.

 

Sputter Masking Tape 0

 

Sticking items condition Measured value
(g/25mm)
notes
SUS Before UV irradiation 960
180°peel
SUS After UV irradiation 20
180°peel
(200mm/min)

 

 

 

Sputter Masking Tape parameter

 

Model Bacjing Total thickne(um) Surface roughness(um) Adhesive thickness(um) Peel strength
(g/inch)
Product Features
E1-IH803
PI
25
30
50#
≥400
Silicone type, anti-static, suitable for large BGA high temperature
Protect. High temperature resistance 260°C, no glue residue.
E1-IH803H
PI
25
30 50# ≥400 Silicone type, anti-static, suitable for large BGA high temperature
Protect. High temperature resistance 290°C, no glue residue.
IH890SY
PI
25
20 50#   Non-silicone type, high temperature resistance, slightly low viscosity, special PI substrate,
Thermal deformation is extremely small, suitable for small-sized BGA shielding protection, resistant to
High temperature 260°C 10min/200°C, 1H to remove no residue,
No metallic yellowing.
UV408CP
PET composite material 100 30 50# ≥900
UV<20g
After UV light, it is easy to peel off and has a soft cushion
Layer, better fit performance, with heat resistance.

 

 

 

Sputter Masking Tape 1

Sputter Masking Tape 2