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Lastest company news about Productronica China 2024 2024/03/29
Productronica China 2024
From March 20-22, 2024, productronica China 2024, an event for the electronic equipment industry, was held at the Shanghai New International Expo Center (SNIEC). Excellent enterprises and exhibitors from all over the world gathered here to explore new opportunities in industry segments. This year's exhibition attracted industry insiders from many countries and regions around the world, more than 900 enterprises gathered in Shanghai, for the electronic equipment industry presented a display of exchanges and trade and cooperation feast, to explore the domestic and international double-cycle development pattern of the electronic equipment industry under the development of new ideas. As a leading manufacturer of ESD adhesive tapes, Cohonk is a regular visitor to the Electronic Equipment Expo. At this exhibition, Cohonkian shined with its products, in addition to SMT splicing tape, SMT splicing tools, PI high temperature tape, PET high temperature tape and other veteran products. Also brought non-silicon high temperature tape, semiconductor packaging tape, pyrolytic adhesive tape, UV adhesive tape and many other star products and QFN packaging tape solutions and BGA packaging tape solutions debut.   Cohonkian this launch of QFN packaging tape solutions and BGA packaging tape solutions and other innovative solutions, with efficient and excellent R & D and production capacity, to protect the key technologies, independent research and development, dedicated to semiconductor chip packaging fixed, ceramic capacitors, PCB board cutting and positioning, and other processes such as the role of the protection of the process. At the exhibition site, Cohongjian attracted many people in the industry to stop and communicate with each other to discuss in detail and share the industry development trend, the direction of ESD tape development and application advantages, we will continue to adhere to independent innovation, strengthen the ability of technological innovation, technological breakthroughs as the goal of contributing to the development of the industry. In the future, Cohongjian will continue to be committed to research and development of high-quality ESD tape products and industry application solutions, and constantly broaden the scope of application of ESD tape products.
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Lastest company news about KHJ appeared at the Munich Shanghai Electronic Equipment Exhibition, a new solution for semiconductor packaging tape 2023/04/17
KHJ appeared at the Munich Shanghai Electronic Equipment Exhibition, a new solution for semiconductor packaging tape
From April 13th to 15th, 2023, the 3-day 2023 Munich Shanghai Electronic Production Equipment Exhibition will be held in Shanghai New International Expo Center!     As a display and exchange platform for the electronics manufacturing industry, the 2023 Munich Shanghai Electronics Production Equipment Exhibition has a scale of 73,000 square meters, attracting 800+ industry companies to participate in the exhibition, covering multiple fields such as Industry 4.0, automotive electronics, and smart factories. One-stop display Global cutting-edge technologies and products in the entire industrial chain of intelligent manufacturing and electronic innovation.     KHJ, as a global electronic ESD tape manufacturer, was invited to participate in the exhibition, bringing a variety of electronic process auxiliary material solutions and special packaging tape solutions to the exhibition.       KHJ's ESD special tape and SMT consumables are widely used in the industrial and electronic fields, such as anti-static high-temperature tape, semiconductor packaging tape, UV adhesive tape, thermal debonding tape, SMT splicing tape, SMT splicing tools, etc. The products are used in semiconductor manufacturing, 5G optical communication, optoelectronic display, precision electronics and other industries.     KHJ's ESD special tape and SMT consumables are widely used in the industrial and electronic fields, such as anti-static high-temperature tape, semiconductor packaging tape, UV adhesive tape, thermal debonding tape, SMT splicing tape, SMT splicing tools, etc. The products are used in semiconductor manufacturing, 5G optical communication, optoelectronic display, precision electronics and other industries.     Automation is realized in various manufacturing processes of electronic products, which saves manpower, reduces costs and increases efficiency, and improves industrial production efficiency. On the first day of the exhibition, the booth of Kehongjian was full of people, attracting many domestic and foreign exhibitors and professionals to come to consult and understand.     UV adhesive tape is an anti-static UV tape with high initial viscosity. After UV irradiation, the adhesive surface viscosity is greatly reduced, and it can be easily peeled off without adhesive residue. It can be applied to various silicon packages, components, ceramic capacitors, and PCB board cutting and positioning protection.     In addition, there is KHJ Technology's electronic manufacturing process auxiliary material solution. From before loading to delivery and storage, Kehongjian can satisfy customers with the auxiliary materials and consumables required for each step.     As a powerful manufacturer of ESD tapes in the global electronics manufacturing industry and a pioneer in SMT splicing, KHJ has continued to innovate, and has adhered to the four core concepts of service, quality, delivery, and cost for 24 years to meet customer needs. We will take the mission of providing more stable auxiliary materials and consumables for industrial production and electronic manufacturing. We will not forget our original intention and forge ahead.
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Lastest company news about Shenzhen KHJ Technology Co.,Ltd participated NEPCON ASIA Show 2019 2021/11/22
Shenzhen KHJ Technology Co.,Ltd participated NEPCON ASIA Show 2019
NEPCON ASIA electronic production equipment and microelectronics industry exhibition was held in shenzhen convention and exhibition center from August 28 to 30, with an exhibition area of 60,000 square meters, making it the largest NEPCON exhibition in history. Six exhibitions integrates together, efforts to build electronic manufacturing industry connectivity platform. As one of the world's top quality electronics manufacturers,NEPCON ASIA has attracted more than 800 exhibitors from 38 countries and regions and 60,000 buyers. Thousands of international buyers are invited to the fair to fully tap the purchasing power of overseas markets.     As a company with 20 years experience in industrial adhesive tape and SMT anti-static materials r&d, production and sales in the integration of national high-tech enterprises, Our Shenzhen KHJ Technology Co.,Ltd (booth No. : 1 IK07) displayed our latest research and development SMT splice trolley with two pliers, biodegradable packing tape, high performance industrial tape products and successfully received many valuation clients from this exhibtion.     The three-day exhibition has been a perfect curtain call. KHJ will keep on pursuing perfect product quality to serve our customers.   This exhibition further expands our popularity and influence in the same industry, and at the same time, it also further understands the product characteristics of advanced companies in order to improve our product structure and advantages. In addition, China's electronics industry is in the process of accelerating structural adjustment and kinetic energy conversion. The technology of the traditional electronics manufacturing industry is constantly upgrading, and the industry is becoming more high-end. A large number of innovative enterprises will emerge in China, and technology and applications are leading in the world. KHJ uses the atmosphere of this exhibition to speed up the pace of research and development, and manufacture more high-quality auxiliary products for the electronics manufacturing industry, making contributions to Kehongjian people for smart factories, intelligent manufacturing, and Chinese forces in the future, and creating more excellent services. For the majority of users.     Address: Add:KHJ industrial park, Building 1, Chuangxin industrial zone, Xintian community, Guanlan,Longhua new district, Shenzhen, China 518110 Tel: 0755-82949965 Fax: 0755-82949800 E-mail: marketing@khj.cn
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Lastest company news about What are the factors that are important for high-temperature tapes in the electronics industry? 2024/06/20
What are the factors that are important for high-temperature tapes in the electronics industry?
When selecting high-temperature tape for use in the electronics industry, several critical factors must be considered to ensure optimal performance and reliability. Here are the key factors: 1. Temperature Resistance Operating Temperature Range: The tape must withstand the maximum temperatures encountered during manufacturing processes, such as soldering, wave soldering, or reflow soldering. Typically, these processes can reach temperatures as high as 260°C (500°F) or more. Thermal Stability: The tape should maintain its adhesive properties and structural integrity at high temperatures without melting, shrinking, or becoming brittle. 2. Adhesion Properties Initial Tack and Bonding Strength: The tape should provide strong initial adhesion to a variety of substrates used in electronic assemblies, including metals, plastics, and ceramics. Long-term Adhesion: It should maintain a strong bond over time, even in high-temperature environments. Residue-free Removal: The tape should be removable without leaving adhesive residue, which could interfere with electronic components or circuit functionality. 3. Electrical Properties Dielectric Strength: High-temperature tapes used in electronics should have good dielectric properties to ensure electrical insulation and prevent short circuits. Low Dielectric Constant and Dissipation Factor: This is particularly important in high-frequency electronic applications to ensure minimal signal loss and interference. 4. Chemical Resistance Solvent and Chemical Resistance: The tape must resist degradation from exposure to common chemicals and solvents used in electronic manufacturing processes, such as fluxes, cleaning agents, and conformal coatings. Moisture Resistance: Resistance to humidity and moisture is crucial to prevent electrical failures and ensure long-term reliability of the electronic components. 5. Mechanical Strength Tensile Strength: The tape should have sufficient tensile strength to withstand mechanical stresses during handling and assembly. Tear Resistance: It should resist tearing during application and removal to maintain integrity and performance. 6. Flexibility and Conformability Conformability: The tape should easily conform to the contours and irregular shapes of electronic components and circuit boards. Flexibility: Flexibility is essential to ensure the tape does not crack or peel off in dynamic applications where the components might undergo movement or vibration. 7. Compatibility with Processes and Materials Reflow and Wave Soldering: The tape should be compatible with high-temperature soldering processes without degrading or releasing harmful fumes. Compatibility with Substrates: It should adhere well to the materials typically used in electronic components, such as FR-4, polyimide, and various metals. 8. Environmental Considerations RoHS Compliance: The tape should comply with the Restriction of Hazardous Substances (RoHS) directive to ensure it is free from harmful substances like lead, mercury, and certain flame retardants. Outgassing: Low outgassing properties are essential to prevent contamination of sensitive electronic components, especially in enclosed or vacuum environments. 9. Cost-effectiveness Cost: While performance is critical, the tape should also be cost-effective, especially for large-scale manufacturing. Availability: The tape should be readily available and sourced from reliable suppliers to avoid disruptions in the production process. In summary, selecting the right high-temperature tape for the electronics industry involves evaluating a combination of thermal, adhesive, electrical, chemical, and mechanical properties to ensure it meets the specific requirements of electronic manufacturing processes and end-use conditions.
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Lastest company news about Semiconductor packaging introduction of wafer dicing blue film applications 2024/04/12
Semiconductor packaging introduction of wafer dicing blue film applications
Semiconductor package   Semiconductor packaging refers to a multi-process, so that the chip can meet the design requirements with independent electrical properties of the process. Packaging process is: from the wafer before the process of wafers through the wafer scribing process, was cut into small grains, and then cut the grains with a solid crystal machine in accordance with the requirements of fixed in the corresponding lead frame in the oven with nitrogen curing, and then use the wire bonding machine will be ultra-fine metal wire bonding pads to connect to the substrate pins, and constitutes the required circuitry; and then the use of molding machine will be independent of the wafer encapsulation with epoxy resin package To encapsulate the protection, this is the semiconductor packaging process. In the package after a series of operations, for finished product testing, and finally into the warehouse shipments.   Application of adhesive film in the packaging process   Semiconductor packaging process, packaging before the wafer cutting and packaging after the substrate cutting, is the entire packaging process is indispensable to the important process, cutting quality directly affects customer satisfaction and the company's benefits, cutting process affects the quality of a number of factors: cutter, cutting parameters, cutting blade, surfactant, coolant, film, etc., has been analyzed in front of the blade, process, cooling water in the cutting Application in cutting process.   Blue film, also known as electronic grade adhesive tape, is mainly used for the protection of glass, aluminum plate, steel plate, because of its cost-effective and suitable for chip cutting, the back was introduced for chip cutting, and is now one of the mainstream wafer cutting tapes for domestic wafer cutting.   Common Abnormalities and Handling Methods In the encapsulation cutting process, often encounter some cutting-related quality problems, caused by many reasons, improper selection of the film will also cause quality problems, common anomalies are: back chipping, flying material, wire drawing, residual adhesive, bubbles, staining. Here mainly from the perspective of the film to analyze the common abnormalities and the corresponding treatment.   Residual glue: 1.DB BLT deviation 2.bad conductivity cause: 1.film expiration 2.adhesive layer off prescription: 1.choose the right adhesive film Fly hopper: 1. hit the knife 2. scratch the product cause: 1. big bubbles, dirty 2. low viscosity of the film prescription: 1. film in accordance with the norms of operation 2. extend the baking temperature and time.   Backfiring: 1. affect the stability of the product cause: 1. slight displacement of the chip 2. blade passivation prescription: 1. choose self-sharpening better blade 2. extend the baking time.   Excessive stickiness: 1.DB fetching difficulty 2.Impact on UPH cause: 1.Film baking temperature and time is too long 2.Film storage time is too long prescription: 1.Replacement of adhesive film with low viscosity 2.Reduction of baking time.
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Lastest company news about Here is the usage method of UV tape 2024/04/07
Here is the usage method of UV tape
Here is the usage method of UV tape:   Prepare the Surface: Ensure that the surface to be bonded is clean, dry, and smooth. Remove any oil, dust, or other debris to ensure proper adhesion of the tape. Cut the Tape: Using scissors or cutting tools, cut the UV tape to the desired size and shape.   Apply the Tape: Gently apply the cut UV tape onto the surface to be bonded. Ensure that the tape adheres fully to the surface, avoiding the formation of bubbles or gaps.   Exposure to UV Light: UV tape requires exposure to ultraviolet (UV) light to cure. Use a UV lamp or other UV light source to expose the applied tape. Determine the exposure time and distance based on the thickness of the tape and the required curing time. Typically, exposure for several seconds to minutes is sufficient for curing UV tape.   Check Curing: After exposure to UV light, check if the UV tape has cured properly. Cured tape should become firm and resistant to movement. If further curing is needed, continue to expose the tape to UV light.   Remove Excess Tape: If there is any excess or squeezed-out tape during application, use a scraper or other tool to remove it.   Post-cure Handling: Once the UV tape is fully cured, you can proceed with further processing, such as trimming edges or applying paint.   Note: Handle UV light sources with care to avoid direct exposure to skin and eyes. Additionally, ensure safe use of UV light sources to prevent any potential hazards.
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