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Non Silicone Polyimide Heat Resistant Adhesive Tape 1.38mil Thickness 3.5N

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China Shenzhen KHJ Technology Co., Ltd certification
China Shenzhen KHJ Technology Co., Ltd certification
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Non Silicone Polyimide Heat Resistant Adhesive Tape 1.38mil Thickness 3.5N

Non Silicone Polyimide Heat Resistant Adhesive Tape 1.38mil Thickness 3.5N
Non Silicone Polyimide Heat Resistant Adhesive Tape 1.38mil Thickness 3.5N Non Silicone Polyimide Heat Resistant Adhesive Tape 1.38mil Thickness 3.5N Non Silicone Polyimide Heat Resistant Adhesive Tape 1.38mil Thickness 3.5N Non Silicone Polyimide Heat Resistant Adhesive Tape 1.38mil Thickness 3.5N

Large Image :  Non Silicone Polyimide Heat Resistant Adhesive Tape 1.38mil Thickness 3.5N

Product Details:
Place of Origin: Guangdong, China
Brand Name: KHJ
Certification: RoHS
Model Number: IH890S
Payment & Shipping Terms:
Minimum Order Quantity: 1pcs
Price: Negotiable
Packaging Details: Plastic bag + carton
Delivery Time: For samples 1-3 days and for mass order depends on your QTY.
Supply Ability: 50000 rolls per month

Non Silicone Polyimide Heat Resistant Adhesive Tape 1.38mil Thickness 3.5N

Description
Product Name: IH890S Temperature Resistance:: 260℃ *5 Mins
Elongation At Break: ≥45% Tensile Strength At Break: ≥5KN/M
Adhesion To Steel: 2-3.5N/25mm Backing Thickness: 0.025mm
High Light:

1.38mil Heat Resistant Adhesive Tape

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3.5N Heat Resistant Adhesive Tape

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1.38mil heat resistant electrical tape

Non Silicone Polyimide Heat Resistant Adhesive Tape 1.38mil Thickness 3.5N

 

Non-silicone polyimide fFilm tape IH890S with excellent heatresistance and insulation properties​

 

IH890S is a polyimide film backed Acrylic adhesive tape with excellent heatresistance and insulation properties.

 

Features And Benefits: 

1. Resistant high temperature up to 260℃.

2. No residue after removal.

3. Excellent anti-aging ability, long shelf life.

 

Properties:
 

Item heat resistant electrical tape Typical Value

 

Test Method

Imperial Metric
Backing 1.0mil 0.025mm /
Total Thickness 1.38±0.2mil 0.035±0.005mm /
Adhesion to Steel 0.45~0.79lbs/in 2~3.5N/25mm GBT 2792-2014
Tensile Strength ≥28lbs/in ≥5(KN/M) GBT 30776-2014
Elongation ≥45% ≥45% GBT 30776-2014

Maximum Operating

Temperature

500℉ 260℃*5min No residue after removal

 

 

Construction:

Non Silicone Polyimide Heat Resistant Adhesive Tape 1.38mil Thickness 3.5N 0

 

Application:

Masking or protecting residue sensitive areas on printed circuit boards during high temperature operations such as wave soldering and reflow soldering.

 

Storage

1. Store under normal conditions of 10-30℃ and 40-70% R.H, out of direct sunlight.

2. Shelf life: 12 months from the date of manufacture when stored in initial packing.

 

Precaution Reminder:

1. Surface should be clean, dry, free of dust, oil or other contaminants.

2. Proper pressure required by roller, hand or press when applying.

3. Avoid repeat sticking to prevent adhesion decrease.

 

Competitive advantages of our factory:

1. Very competitive price and high quality control.

2. Timely delivery.

3. Environmentally friendly products.

4. Various designs.

 

Notes:

Please be advised that this technical data sheet is written based on our lab tests and experience only. Customer is responsible to determine the suitability of the product meets intended application requirements before approved for use.

Contact Details
Shenzhen KHJ Technology Co., Ltd

Contact Person: sales

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