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Package--package body:
Refers to different shapes of packages formed by chips (Die), different types of frames (L/F) and plastic encapsulants (EMC).
There are many types of IC Package, which can be classified according to the following standards:
Divided by packaging material:
Metal package, ceramic package, plastic package
According to the connection method with the PCB board, it is divided into:
PTH package and SMT package
According to the package appearance can be divided into:
SOT, SOIC, TSSOP, QFN, QFP, BGA, CSP, etc.;
QFN—Quad Flat No-lead Package
SOIC—Small Outline IC small outline IC package
TSSOP—Thin Small Shrink Outline Package Thin Small Outline Package
QFP—Quad Flat Package
BGA—Ball Grid Array Package ball grid array package
CSP—Chip Scale Package Chip Scale Package
