Send Message
Shenzhen KHJ Technology Co., Ltd
Mail: marketing@khj.cn TEL: 86-0755-28102935
Home
Home
>
News
>
Company news about Is it better to use UV tape or pyrolysis adhesive tape for semiconductor dicing tape?
Events
LEAVE A MESSAGE

Is it better to use UV tape or pyrolysis adhesive tape for semiconductor dicing tape?

2024-01-30

Latest company news about Is it better to use UV tape or pyrolysis adhesive tape for semiconductor dicing tape?

The choice between UV tape and pyrolysis adhesive tape for semiconductor dicing tape depends on various factors, including the specific requirements of your semiconductor manufacturing process. Both types of tapes have their advantages and considerations:

  1. UV Tape:

    • Advantages:

      • Fast and efficient bonding: UV tapes typically offer quick adhesion when exposed to ultraviolet light, allowing for rapid processing.
      • Low-temperature bonding: UV tapes often bond at lower temperatures, which can be beneficial for certain semiconductor materials that are sensitive to heat.
      • Clean release: UV tapes generally provide a clean and residue-free release during the dicing process.
    • Considerations:

      • UV light source requirement: UV tapes require a UV light source for the curing process, which adds equipment complexity.
      • Limited temperature resistance: UV tapes may have limitations in terms of high-temperature resistance during subsequent processing steps.
  2. Pyrolysis Adhesive Tape:

    • Advantages:

      • High-temperature resistance: Pyrolysis tapes can withstand higher temperatures during subsequent manufacturing steps, providing versatility in processing.
      • No UV light source required: Pyrolysis tapes do not rely on UV light for curing, simplifying the equipment setup.
      • Suitable for various materials: Pyrolysis tapes are often compatible with a wide range of semiconductor materials.
    • Considerations:

      • Longer processing time: Pyrolysis tapes may have longer curing times compared to UV tapes.
      • Potential residue: Some pyrolysis tapes may leave a residue after dicing, which might require additional cleaning steps.

Decision Factors:

  • Processing Requirements: Consider the specific requirements of your semiconductor manufacturing process, including temperature constraints and curing time.
  • Equipment Availability: Evaluate whether your facility has the necessary UV light sources for UV tape curing.
  • Material Compatibility: Assess the compatibility of each type of tape with the semiconductor materials used in your production.

Ultimately, the choice between UV tape and pyrolysis adhesive tape depends on your specific production needs and equipment capabilities. It may be beneficial to conduct trials with both types of tapes in your specific manufacturing environment to determine which one best meets your requirements.

Contact Us at Any Time

86-0755-28102935
KHJ Industrial park, Building 1,Chuangxin Industrial park, Xintian community, Guanlan, Longhua new district, Shenzhen,China 518110
Send your inquiry directly to us