Semiconductor Packaging tape adopts various encapsulation methods

Semiconductor Packaging tape is a tape used for encapsulating semiconductor components, which has good heat resistance, moisture resistance, chemical resistance and aging resistance. It can effectively prevent the contamination and damage of packaged components, and can improve the reliability of packaged components.

Semiconductor Packaging tapes are used in a variety of encapsulation methods, the most common of which are thermal encapsulation and cold encapsulation. Thermal packaging is to fix the semiconductor element on the substrate and then package it with hot melt adhesive. This packaging method has good insulation and heat resistance, but its cost is relatively high.

Cold packaging is to fix the semiconductor element on the substrate and then encapsulate it with adhesive tape. This packaging method is low in cost, but has poor insulation and heat resistance.

Therefore, when purchasing semiconductor packaging tape, you should choose the appropriate packaging method according to the actual application needs, and choose a tape with good heat resistance, moisture resistance, chemical resistance and aging resistance to ensure the reliability of the packaging components and security.