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Company news about SMT splicing tape

SMT splicing tape


Latest company news about SMT splicing tape

SMT (surface mount technology) is an advanced form of electronics assembly technology and process currently utilized in the industry. SMT condenses traditional electronic components into devices with only a fraction of their volume compared with previous technologies used for assembly. Surface mount technology is not a new concept; its roots lie with earlier processes such as flush mount and hybrid mount. At first, electronic circuit assembly was completed using point-to-point wiring without any substrate underneath them. Premium SMT Lead Tape When semiconductor devices were first manufactured, they were housed with radial leads inserted through through-holes on monolithic circuit boards already used to package resistor and capacitor packages. Later, flat-pack surface mount components became popular among military forces due to their high reliability. In the 1960s and 1970s, hybrid technology was widespread; due to Japanese consumer electronics-influenced passive component usage in the 70s; this trend continued into the next decade when active components began replacing passives as widespread options. SMT features include high assembly density, small size and light weight of electronic products. SMT products feature high reliability and strong anti-vibration ability; low solder joint defect rates with excellent high frequency characteristics; minimal electromagnetic and radio frequency interference, SMT primer tape is easy to automate production efficiency, cutting costs by 30%-50. Save material, energy, manpower and time while improving production efficiency!

SMT splicing tape

China has experienced rapid localization of Surface Mount Technology equipment since 1985 when production lines first used SMT to mass produce color TV tuners using SMT technology were set up. Since then, nearly three decades have gone by where China's electronics manufacturing industry has used SMT for mass-producing color tuners using this technique. According to estimates from unreliable statistics, my country currently hosts approximately 50,000 SMT production lines and an estimated total of 100,000+ tape mounters; of these mounters, automated mounters accounted for 40% of global market shares, making this SMT market one of the world's biggest. Welding, testing and printing equipment has reached international advanced levels. On production lines we frequently come across "technical talents" who take great pride in showing off their talents - as if producing high-quality SMT primer tapes was of secondary importance compared to their own abilities. Every time I meet such individuals, my concerns for their future grow stronger. Managers typically view them as stupid and thick which does not promote stability and unity within teams and limits usage thus being seen off in technical positions as viable employees. My personal viewpoint is that technology and management should complement each other; however, in terms of domestic SMT industry environments, management has proven faster. SMT technical talent with established technical backgrounds may choose whether or not to transition into management based on their individual circumstances.

SMT splicing tape

At present, four main types of stencils used in SMT processes are chemically etched stencils; laser-cut stencils; electroformed stencils and hybrid process stencils. 1. Chemical Etching of Stencils Chemical Etching of stencils involves using corrosive chemical solutions to eliminate metal corrosion in an opening of stainless steel sheet, producing openings corresponding to PCB pad sizes, and producing stencils required for production. Manufacturing process of SMT primer tape: cutting steel sheet of appropriate size with high-quality SMT primer tape cutter; cleaning; coating photoresist material - UV exposure, development, drying; chemical etching stripping photoresist material from its mold, chemical stripping cleaning drying inspection stretching packaging Chemical etching removes metal components from both sides of a steel sheet simultaneously, so its hole wall will appear straight and smooth, but some metal may remain at the central part of thickness to form an irregular tapered shape that has the cross sectional appearance of a water leak. Etched stencils do not facilitate solder paste release and, therefore, are generally not recommended for precision component assembly. SMT lead tape components typically have lead pitches of less than 0.5mm, so using etched steel mesh for components under 0402 sizes may not be cost effective or meet production quality requirements. However, large components or those with large pitch values may benefit from its cost effectiveness, providing greater cost efficiencies and meeting production quality specifications more easily than otherwise possible.


SMT splicing tape is used extensively within the SMT placement industry and typically found in placement machines. Our tray typically carries limited components; our tray of parts should be complete after placement is complete. Stopping, reloading and correcting pick-up position all take approximately 2 minutes in total for SMT machines; PCBs typically need several components daily so this time savings could prove vital to their production line. Lossing two minutes per disk each day adds up. Before fully mounting the parts, use splicing tape to connect plates of new and nearly used-up materials for seamless splicing without stopping the machine; this greatly decreases time waste in production. Even when equipment is powered on and not functioning, it is a waste. SMT splicing tapes come in various sizes for SMT applications such as 8mm, 12mm, 16mm and 24mm; SMT primer tape 8mm refers to carrier tape suitable for this width of SMT tape. As SMD component package carrier tape has an international uniform width of 8mm, 12mm or is essential that we understand that "high-quality SMT primer tape 8mm" doesn't refer to the width of its own tape but rather indicates carrier tape widths.

SMT splicing tape

Today, our editor will present relevant knowledge regarding SMT stencil wiping paper. What are the materials and characteristics of SMT stencil wiping paper? Wood pulp fiber produced through air-laid technology serves as its raw material source for SMT stencil wiping paper production. SMT stencil wiping paper production involves two main processes of netting and reinforcement, as well as chemical bonding and thermal bonding methods. Furthermore, its features are as follows: 1. SMT primer belt has excellent dust removal effect and strong anti-static function; 2. It has high water absorption; 3. Its soft surface won't harm objects; 4. It provides sufficient dry and wet strength; 5. Ion release is very low; and 6. 7. Edge cutting machines seal off the edges of SMT stencil wiping paper, so particles and thread ends won't get left behind when wiping; high-quality SMT primer tape offers strong decontamination ability; 8. Optional edge banding includes ultrasonic cutting as well as cold cutting methods.


SMT stands for Surface Mount Technology and refers to an electronic assembly process using SMT splicing pliers as the tool used to connect SMT component material tapes. SMT splicing pliers are used primarily to press and insert copper buckles into material tape edges and paste splicing tape onto them. SMT splicing pliers have the power to increase work efficiency by 35%, save materials by 40%, utilize remaining materials more effectively and reduce shutdowns while prolonging machine service life. Sichuan SMT lead tape can cut component carrier tapes neatly, and its copper buckle can be installed onto the positioning pin of splicing pliers to press them against carrier tape, then clamp up and down securely to complete.

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