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Home > PRODUCTS > Semiconductor Packaing Tape > Semiconductor packaging tape,Chip packaging tape,Anti Static Polyimide protective film

Semiconductor packaging tape,Chip packaging tape,Anti Static Polyimide protective film

Product Details

Place of Origin: Guangdong, China

Brand Name: KHJ

Certification: RoHS

Model Number: E1-IH810B

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: Negotiable

Packaging Details: Plastic bag + carton

Delivery Time: 3~5days after payment done

Payment Terms: L/C, T/T

Supply Ability: 10000 square meters/day

Get Best Price
Product Details
Highlight:
Product Name:
E1-IH810B
Backing Thickness:
0.025±0.003
Total Tape Thickness:
0.035±0.005
Tensile Strength At Break:
≥3.5(KN/M)
Elongation At Break:
≥45%
Upmost Temperature:
260℃
Product Name:
E1-IH810B
Backing Thickness:
0.025±0.003
Total Tape Thickness:
0.035±0.005
Tensile Strength At Break:
≥3.5(KN/M)
Elongation At Break:
≥45%
Upmost Temperature:
260℃
Product Description

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Masking Polyimide Heat Resistant Tape Anti Static Silicone Coated

 

Low static heating resistant masking polyimide tapeE1-IH810B heat resistant adhesive tape with good heating resistance

 

IH810B is a polyimide film back coated silicone adhesive with low-adhesion which has excellent antistatic performance and high temperature resistance.

 

Features And Benefits: 

1. Low electrostatic discharge at unwind and removal.

2. Excellent anti-static performance and High Temperature Resistance .

3. High initial adhesion, Good sealing performance.

4. RoHS Compliant.

 

Black Kapton Tape Properties:

Item Test Value Test Method
Backing thickness (mm) 0.025±0.003 Micrometer
Total thickness (mm) 0.035±0.005 Micrometer
Release liner Thickness(mm) 0.075±0.003 Micrometer
Diameter of Core(mm) 77±2 calipers
Adhesion(N/25mm) 4-5 GBT 2792-2014
Tensile Strength (KN/M) ≥3.5 GBT 30776-2014
Elongation (%) ≥45
Upmost using Temperature(℃) 260℃  

 

Construction:

Semiconductor packaging tape,Chip packaging tape,Anti Static Polyimide protective film 3

Application:

Semiconductor packaging,Chip packaging.Used for high temperature protection of different packaging processes, and temporary fixation in high temperature processes. As a carrier, it supports and protects ultra-thin objects during the transfer process. It is also suitable for surface protection that needs to be removed after high temperature and no residue.

 

Storage:

1. Store under normal conditions of 10-30℃and 40-70% R.H, out of direct sunlight.

2. Shelf life:12 months from the date of manufacture when stored in initial packing.

 

Precaution Reminder:

1. The product should be far away from heat and fire sources;

2. Surface should be clean, dry, free of dust, oil or other contaminants.

3. Proper pressure required by roller, hand or press when applying.

4. Avoid repeat sticking to prevent adhesion decrease.

5. The product can not be used outdoors, to avoid the influence of outdoor weather, there will be residue on the object when the tape is removed.

 

Competitive advantages of our factory:

1. Very competitive price and high quality control.

2. Timely delivery.

3. Environmentally friendly products.

 

Notes:

The above data is measured by laboratory standards. The actual data may be different due to the user's use conditions and methods. It is recommended to test the product before use.