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Thermal Release Tape
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TS650RN Thermal Release Tape for Semiconductor Wafer Dicing & Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET Substrate 110-140°C | SMT Die-Cutting Electronics Manufacturing | KHJ

TS650RN Thermal Release Tape for Semiconductor Wafer Dicing & Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET Substrate 110-140°C | SMT Die-Cutting Electronics Manufacturing | KHJ

Brand Name: KHJ
Model Number: TS650RN
Detail Information
Place of Origin:
ShenZhen China
Certification:
ROHS
Color:
White Translucent
Total Thickness:
0.153±0.005mm
Product Description
Description
 
TS650RN is a white translucent thermal separation tape with high initial viscosity. At a certain temperature (110~140℃), the adhesive surface foams
and viscosity disappears, allowing automatic separation from the adhered object.
 
Construction
 
Construction TS650RN
 
Features
 
* Easily peeled off by heat treatment at any time
* Initial temperature resistance and will not Anti-stick
* RoHS Compliant
 
Application
* This product is suitable for temporarily fixing various types of components,ceramics, glass, metal plates, etc.
 
Properties

 

Item Typical Value Test Method
Imperial Metric
Backing 4.0mil 0.1mm /
Total Thickness 6.12mil 0.153±0.005mm /
Adhesion Before heating 1.2-1.87lbs/in 5.5-8.5N/25mm GBT 2792-2014
After heating 0 0
Tensile Strength ≥55bs/in ≥10(KN/M) GBT 30776-2014
Elongation ≥120% ≥120% GBT 30776-2014

 

Recommended debonding process: 130℃*3-15min(based on the heating method and the thermal conductivity and heat transfer uniformity of the attached object)

 

Storage

 

* Store under normal conditions of 10-30℃ and 40-70% R.H, out of direct sunlight.

* Shelf life: 12 months from the date of manufacture when stored in initial packing.

 

Precaution Reminder

 

 

* Surface should be clean, dry, free of dust, oil or other contaminants.

* Proper pressure required by roller, hand or press when applying.

* Avoid repeat sticking to prevent adhesion decrease.

 

Notes

 

Please be advised that this technical data sheet is written based on our lab tests and experience only. Customer is responsible to determine the suitability of the product meets intended application requirements before approved for use.