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| Brand Name: | KHJ |
| Model Number: | DTS640A |
1. Product Description
DTS640A is a double-sided tape with good initial tack. One side features a foamed (thermally expandable) adhesive layer, while the other side is a conventional pressure-sensitive adhesive (PSA) layer. When heated at 150–160°C, the foamed adhesive layer gradually loses its tack and enables automatic detachment from the bonded substrate.
2. Product Structure
3. Product Features
✔ Initial heat resistance with no re-tack (no sticky residue after thermal debonding)
✔ Strong instant adhesion; components are easily removed without residue after thermal debonding
✔ ROHS compliant
4. Applications
This product is suitable for temporary fixing of various electronic components, ceramics, glass, metal plates, and other substrates. It is also used for specialty cutting protection across the electronics manufacturing industry.
5. Technical Specifications
| Test Item | Specification / Value | Test Method |
| Total Tape Thickness (excl. liner) (μm) | 150 ±5 | Micrometer |
| Base Film Thickness (μm) | 75 ±3 | Micrometer |
| Foamed Adhesive Layer Thickness (μm) | 55 ±5 | Micrometer |
| Foamed Adhesive 180° Peel Strength (gf/25mm) | 1,100 ± 300 | Per GB/T 2792-2014 |
| Foaming Start Temperature (°C) | 120 | T MA |
| Optimal Foaming Temperature (°C) | 150–160 | T MA |
| PSA Layer Thickness (μm) | 20 ±5 | Micrometer |
| PSA Layer 180° Peel Strength (gf/25mm) | 200 ± 100 |
Per GB/T 2792-2014
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6. Recommended Debonding Process
150–160°C × 4–15 min (duration may vary depending on the heating method, thermal conductivity of the substrate, and heat transfer uniformity)
7. Storage
Storage conditions: 10–30°C, 40–60% relative humidity
Shelf life: 6 months from date of manufacture under recommended storage conditions
8. Precautions
• Keep away from heat sources and open flames.
• Substrate surfaces must be clean, dry, and free from oil, grease, or other contamination.
• Do not use outdoors. Exposure to outdoor weather conditions may cause adhesive residue to remain on the substrate upon tape removal.
