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| Brand Name: | KHJ |
| Model Number: | TS658M |
Description
TS658M is a white translucent thermal release tape with high initial viscosity. At (150-160℃), The stickiness of the adhesive surface disappears and automatic separation from the object to be adhered can be achieved.
Construction
Features
* Easily peeled off by heat treatment at any time
* Initial temperature resistance and will not re-tack
* RoHS Compliant
Application
This product is suitable for temporarily fixing various types of components, ceramics, glass, metal plates, etc., and is suitable for various electronic industry specialties. kind of cutting protection.
Properties
| Test Item | Typical Value | Test Method | |
| Backing Thickness(um) | 75 | Micrometers | |
| Total Thickness(um) (Liner Removed) |
140 | Micrometers | |
| 180°Peel Strength (gf/25mm) |
Before heating | 2500 | GB/T 2792-2014 |
| After heating |
＜5 | ||
Recommended debonding process: 150-160℃*3-10min(based on the heating method and the thermal conductivity and heat transfer uniformity of the attached object)
Storage
* Store under normal conditions of 5-35℃ and 35-80% R.H, out of direct sunlight.
* Shelf life: 6 months from the date of manufacture when stored in initial packing.
Precaution Reminder
* Surface should be clean, dry, free of dust, oil or other contaminants.
* Proper pressure required by roller, hand or press when applying.
* Avoid repeat sticking to prevent adhesion decrease.
Notes
Please be advised that this technical data sheet is written based on our lab tests and experience only. Customer is responsible to determine the suitability of the product meets intended application requirements before approved for use.
