logo
Send Message

products details

Created with Pixso. Home Created with Pixso. PRODUCTS Created with Pixso.
Semiconductor Packaing Tape
Created with Pixso.

KHJ TS651ZF Heat Release Tape Acrylic Adhesive Ultra-Thin Wafer Dicing Delicate Factory Manufacturer

KHJ TS651ZF Heat Release Tape Acrylic Adhesive Ultra-Thin Wafer Dicing Delicate Factory Manufacturer

Brand Name: KHJ
Model Number: TS651ZF
Detail Information
Place of Origin:
China
Certification:
RoHS
Product Description

PRODUCT DESCRIPTION

 

TS651ZF is a white heat-release adhesive tape with high initial tack. It retains adhesion at elevated temperatures until the adhesive foams and loses tack at 190℃, achieving automatic separation from the substrate.

 

Product Structure

 

Thermal Release  Tape-TS658M

 

 

Product Features

* Initial heat resistance; non-re-tacky

* High instantaneous adhesion with precise positioning; components are easily removed after heat debonding, leaving no adhesive residue

 

Product Applications

Suitable for temporary fixation and cutting protection of various components, ceramics, glass, metal plates, etc.

 

 

Performance Parameters

Test Item Specification Test Method
Substrate Thickness (μm) 100±3 Micrometer
Product Thickness (excl. release liner) (μm) 155±5 Micrometer

180° Peel Adhesion

(g/25mm)

Before heat debonding ≥500

Per GBT 2792-2014

 

After heat debonding Non-tacky

 

◎ Recommended debonding process: 185℃–195℃ for 3–15 min. The adhesive layer is fully foamed and non-tacky; do not exceed 20 min of heating.

(Depending on the thermal conductivity and heating uniformity of the substrate)

 

Storage

Storage conditions: 10-30 ℃, relative humidity 40-60%. Shelf life: 6 months

Precautions

* Keep the product away from heat sources and open flames.

 

* The surface of the substrate must be clean, dry and free from oil or other contamination.

* Do not use the product outdoors; avoid outdoor weather conditions that may cause adhesive residue to remain on the substrate upon removal.