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Semiconductor Packaing Tape
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UV396US UV Release Tape for BGA Semiconductor Packaging | UV-Curable Low Residue Dicing Tape for Wafer Processing, Die Bonding, Back Grinding & Chip Mounting - B2B Custom Wholesale KHJ Manufacturer

UV396US UV Release Tape for BGA Semiconductor Packaging | UV-Curable Low Residue Dicing Tape for Wafer Processing, Die Bonding, Back Grinding & Chip Mounting - B2B Custom Wholesale KHJ Manufacturer

Brand Name: KHJ
Model Number: UV396US
Detail Information
Place of Origin:
China
Certification:
RoHS
Product Description

Description


UV396US is a single-sided, UV-curable release tape engineered for temporary bonding applications. It offers strong initial tack that holds materials firmly in place during processing; after exposure to UV light, the adhesive's bonding force drops sharply, allowing the tape to be peeled away quickly and cleanly.

 

Construction


UV tape

Features


  • Consistent, dependable performance across repeated process cycles
  • Strong immediate adhesion secures components firmly during machining, and after UV debonding parts can be lifted off effortlessly with zero adhesive residue.
  • Fully RoHS-compliant formulation

Application


  • Designed for dicing, cutting, and positioning protection on a wide range of substrates, including silicon wafers, glass panels, ceramic capacitors, and PCB assemblies.

Product Properties


Item Typical Value Test Method
Backing 0.1mm /
Total Thickness 0.12mm /
Adhesion to Steel Before UV 2000gf/25mm GBT 2792-2014
After UV 5gf/25mm

 

 

 

UV curing conditions: an irradiation energy of 500-600 mJ/cm2 at a dominant wavelength of 365 nm is required.

 

Storage


  • Store in a dark, opaque environment away from direct light, under normal conditions of 5-30 ℃ and 35-80 % relative humidity.

Shelf life: six months from the date of manufacture when kept in the original, unopened packaging.

 

Precaution Reminder


  • The bonding surface must be clean and dry, completely free of dust, oil, grease, or any other contamination.
  • Apply firm, uniform pressure using a roller, hand, or press during application to ensure full contact.
  • Avoid lifting and re-applying the tape repeatedly, as this will progressively reduce its bonding strength.

Notes


The information contained in this technical data sheet is provided solely on the basis of our laboratory testing and practical experience. It is the customer's responsibility to evaluate and confirm that the product is suitable for their specific application before approving it for use.