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5.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process

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5.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process

5.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process
5.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process 5.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process 5.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process 5.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process

Large Image :  5.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process

Product Details:
Place of Origin: Guangdong, China
Brand Name: KHJ
Certification: RoHS
Model Number: MH310C
Payment & Shipping Terms:
Minimum Order Quantity: 1pcs
Price: Negotiable
Packaging Details: Plastic bag + carton
Delivery Time: For samples 1-3 days and for mass order depends on your QTY.
Supply Ability: 50000 rolls per month

5.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process

Description
Product Name: MH310C Adhesion To Steel: 7~8N/25mm
Tensile Strength: ≥2(KN/M) Elongation: ≥5%
Temperature Resistance: 200℃ Total Tape Thickness: 0.13±0.01mm
High Light:

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5.2mil high temp masking tape

5.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process
 
High Temperature Crepe Paper Tape MH310C Masking During Wave Soldering Process

 

MH310C is crepe paper based tape with super temperature resistant properties, which is ideal for masking items during high temperature process.

 

High Temp Masking Tape Features And Benefits: 

1. Resistant high temperature up to 200℃.

2. RoHS Compliant.

3. Strong adhesion, no residue after removal.

 

Properties:

Item Typical Value
Imperial Metric
Total Thickness 5.2mil 0.13±0.01mm
Adhesion to Steel 1.6~1.8lbs/in 7~8N/25mm
Tensile Strength ≥11.43lbs/in ≥2(KN/M)
Elongation ≥5% ≥5%
Temperature Resistance 392℉ 200℃

 

Construction:

5.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process 0

Application:

Mainly used in the protection of the gold finger and other jacks on the circuit board during the wave soldering process of the circuit board.

 

Storage:

1. Store under normal conditions of 10-30℃ and 40-70% R.H, out of direct sunlight.

2. Shelf life: 12 months from the date of manufacture when stored in initial packing.

 

Precaution Reminder:

1. Surface should be clean, dry, free of dust, oil or other contaminants.

2. Proper pressure required by roller, hand or press when applying.

3. Avoid repeat sticking to prevent adhesion decrease.

 

Why buy from us instead of buying from other suppliers?

1. Good location and convenient transportation.

2. Good reputation and after-sales service team.

 

Notes:

Please be advised that this technical data sheet is written based on our lab tests and experience only. Customer is responsible to determine the suitability of the product meets intended application requirements before approved for use.

Contact Details
Shenzhen KHJ Technology Co., Ltd

Contact Person: sales

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