logo
Send Message
Shenzhen KHJ Technology Co., Ltd
english
français
Deutsch
Italiano
Русский
Español
português
Nederlandse
ελληνικά
日本語
한국
Türkçe
bahasa indonesia
tiếng Việt
ไทย

products details

Created with Pixso. Home Created with Pixso. PRODUCTS Created with Pixso.
Masking Tape
Created with Pixso.

5.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process

5.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process

Brand Name: KHJ
Model Number: MH310C
MOQ: 1pcs
Price: Negotiable
Supply Ability: 50000 rolls per month
Detail Information
Place of Origin:
Guangdong, China
Certification:
RoHS
Product Name:
MH310C
Adhesion To Steel:
7~8N/25mm
Tensile Strength:
≥2(KN/M)
Elongation:
≥5%
Temperature Resistance:
200℃
Total Tape Thickness:
0.13±0.01mm
Packaging Details:
Plastic bag + carton
Supply Ability:
50000 rolls per month
Highlight:

5.2mil Crepe Paper Tape

,

ODM Crepe Paper Tape

,

5.2mil high temp masking tape

Product Description

5.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process 05.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process 15.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process 2

5.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process
 
High Temperature Crepe Paper Tape MH310C Masking During Wave Soldering Process

 

MH310C is crepe paper based tape with super temperature resistant properties, which is ideal for masking items during high temperature process.

 

High Temp Masking Tape Features And Benefits: 

1. Resistant high temperature up to 200℃.

2. RoHS Compliant.

3. Strong adhesion, no residue after removal.

 

Properties:

Item Typical Value
Imperial Metric
Total Thickness 5.2mil 0.13±0.01mm
Adhesion to Steel 1.6~1.8lbs/in 7~8N/25mm
Tensile Strength ≥11.43lbs/in ≥2(KN/M)
Elongation ≥5% ≥5%
Temperature Resistance 392℉ 200℃

 

Construction:

5.2mil High Temperature Crepe Paper Tape Masking For Wave Soldering Process 3

Application:

Mainly used in the protection of the gold finger and other jacks on the circuit board during the wave soldering process of the circuit board.

 

Storage:

1. Store under normal conditions of 10-30℃ and 40-70% R.H, out of direct sunlight.

2. Shelf life: 12 months from the date of manufacture when stored in initial packing.

 

Precaution Reminder:

1. Surface should be clean, dry, free of dust, oil or other contaminants.

2. Proper pressure required by roller, hand or press when applying.

3. Avoid repeat sticking to prevent adhesion decrease.

 

Why buy from us instead of buying from other suppliers?

1. Good location and convenient transportation.

2. Good reputation and after-sales service team.

 

Notes:

Please be advised that this technical data sheet is written based on our lab tests and experience only. Customer is responsible to determine the suitability of the product meets intended application requirements before approved for use.