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Lastest company news about PI high-temperature resistant tape The following points should be noted 2023/04/04
PI high-temperature resistant tape The following points should be noted
PI high-temperature resistant tape is a special type of high-temperature resistant tape that has excellent high-temperature resistance and can be used in the temperature range of -269 ℃ to 400 ℃. It has good oil resistance, climate resistance, chemical corrosion resistance, UV linear resistance, wet heat resistance, tensile resistance, impact resistance and other characteristics, and can meet the bonding requirements in various high-temperature environments. When using PI high-temperature resistant tape, The following points should be noted: Before using PI high-temperature resistant tape, the surface should be cleaned to ensure the adhesive effect of the tape. When bonding PI high-temperature resistant tape, folding should be avoided as much as possible to avoid affecting the bonding effect. When bonding PI high-temperature resistant tape, it is advisable to avoid contact with oil stains as much as possible to avoid affecting the bonding effect. When bonding PI high-temperature resistant tape, it is advisable to avoid contact with moisture as much as possible to avoid affecting the bonding effect. When bonding PI high-temperature resistant tape, it is advisable to avoid contact with strong magnetic fields as much as possible to avoid affecting the bonding effect. When bonding PI high-temperature resistant tape, it is advisable to avoid contact with acidic or alkaline substances as much as possible to avoid affecting the bonding effect. When bonding PI high-temperature resistant tape, it is advisable to avoid contact with high temperatures as much as possible to avoid affecting the bonding effect. When bonding PI high-temperature resistant tape, it is advisable to avoid contact with pollutants as much as possible to avoid affecting the bonding effect. ​ The above are the precautions for using PI high-temperature resistant tape. We hope that everyone can pay attention to the above points when using PI high-temperature resistant tape to ensure the adhesive effect of the tape.
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Lastest company news about Tips About Splice Tape For Web Offset Printing 2021/11/23
Tips About Splice Tape For Web Offset Printing
I want to share a few tips on splice tape that we have learned recently. Above is a splice that we normally set for our flying paster, or splicer as many call it. Some presses use zero speed splicers and a couple of the points here can be applicable. The main point though is that splice tape must be as sticky as possible.   Below I describe our problem, but I would suggest you familiarize yourself with what aflying paster is if you do not have one. Or watch this video of ours.   The problem that we have had over the colder months is that splice tape is not as effective on cold rolls. We miss splices because the tape doesn't stick as well to the cold paper. To stick at high speeds with low temperatures places high demands on the tape. High speed video revealed that the paper just wasn't sticking properly from the expiring roll to the new one. Megtec themselves admit this problem. Therefore we found ourselves missing about 1 in 10 splices. I visited several web presses over the fall in Europe and found they had the same problems. Therefore here is what we did.   Used a Core Heater   We do not have the luxury of storing our paper for a week or more in a nice warm, cozy factory. Often our paper comes by truck and the paper is stone cold. Generally when our rolls get below 17 degrees, we start missing splices.   Therefore we purchased a roll core heater. About $1000 later we had a device that could do the trick. Much like a simple blow dryer, it would blow hot hair through the core. However we didn't always have the luxury of time to heat the core up enough. So we tried something else.
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Lastest company news about ISSUES IN FILM PRESERVATION: SPLICE TAPE TARNISH ON BLACK AND WHITE FILM 2021/11/23
ISSUES IN FILM PRESERVATION: SPLICE TAPE TARNISH ON BLACK AND WHITE FILM
One of the main issues I have with many of the films I have been working on is splice tape varnish. This is a distinct degradation of the silver particles in the emulsion caused by the breakdown of the spice tape glue.   I discovered that tape on the base side of the film tarnishes far less than splice tape on the emulsion side. This makes sense as tape on the emulsion side is closer in proximity to the silver particles than tape on the base side. Also, tape on the base side removes and cleans up fairly easily with minimal noticeability. Tape on the emulsion side is extremely noticeable and far more difficult to remove. Mark recommends soaking the tape in film cleaner or what works for me since the tape I am working on is not too bad is gently use tweezers to pull the tape off. Start at the edges of the film outside of the frame lines to prevent any scratching of the image. Rule no. 1 – Do No Harm.   Once tape is removed use whatever film cleaner you have and a cleaning rag or q-tips and gently clean the tape glue that is stuck tothe film. Be careful with glue on the emulsion side because it likes to stick pretty bad. Soaking will help get it off or use plenty of film cleaner to loosen the residual dirtiness. Once the nastiness has been cleaned off there is little else one can do.   There is no fix for the tarnished silver particles aside from removing them. Splicing out frames has to be made on a case by case basis by the individual film preservationist. I decided not to remove the damaged pieces in the hopes that digital restoration will be able to fix the color and more importantly it is the only copy in our library.
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Lastest company news about EMC World–tale of the ESD tape 2021/11/23
EMC World–tale of the ESD tape
The numbers of these large scale events are amazing. While the most important number is the 15,000+ customers, partners and others who attended – there are some other amazing numbers.   One amazing success this year was the EMC Hands-On-Labs (HoL). Here’s the tale of the tape – the infrastructure behind the scenes, which labs were the most popular, and customer feedback.I want to put out my THANK YOU to the teams behind this – Simon Seagrave most of all who lead and championed the efforts. We took a different take on the HoL this year – teaming up with the VMware Nee team who have built a killer front-end for these sorts of events. Also, for each station, a team from the engineering team of the products represented and EMC SEs were the content champions and manned the labs. It’s a marathon to produce, and then a marathon to support (with a small number of folks wimping out and bailing, just like in a real marathon). Huge thanks to the VMware Nee team and to all of the lab content champions. With the exception of Lab #3 (ViPR), the labs are immediately going into vLab. The ViPR lab (which was one of the most popular at the event!) will be up soon, but as we’re going through ViPR builds at the speed of light, will wait a little longer as we approach GA.   So – what goes into something this big and awesome? What are the numbers, the tale of the tape? How many miles did I walk at EMC World 2013? Read on….   For those of you that know me/follow this blog – you know that I firmly believe that at technical conferences, with technical audiences – the HoL is hugely important. It’s where all the marketing falls to the wayside, and the rubber hits the road.   Here’s a panoramic view of the EMC World 2013 HoL:And here it is at a lightly loaded time – about 83 people doing labs. At peak, it was packed, and all 300 seats filled.What did customers think? If you’re a vendor doing conferences – look at the feedback. Hold HoLs – the customers love them.   This is my favorite!By the end of the week, the big screen that tallied up the numbers showed that we did 2502 labs, and during that time, created and destroyed 19,711 VMs. Huge – and much more than last year. Still only about half the load of VMworld, but they’ve been doing the HoLs for an extra year – we will   Everyone always wonders about the backend Infrastructure: The backend infrastructure was run out of the EMC Durham, NC data center based on VCE architecture:   Compute: 96 x Cisco UCS B230 M2 - 2 x Ten-Core Westmere-EX E7-2870 Processors - 512GB RAM 16 x Cisco UCS B22 M3 - 2 x Eight-Core Sandy-Bridge E5-2470 Processors - 96GB RAM An interesting note: these 16 blades were provided by ESD for the purposes of running the VMAX VSA – more memory efficient for the lab. The VMAX VSA is… shall we say “plump” :-)   Storage: 8 x XtremIO X-Bricks (for crazy IOps as needed) 4 x VNX7500s (the bulk of stuff) Here are the labs listed in order of popularity (number of labs completed listed) 1 LAB03 - EMC ViPR: 394 2 LAB01 - SRM Suite: Visualize, Analyze, Optimize: 199 3 LAB23 - VNX Unisphere Analyzer: 194 4 LAB11 - Operational and Disaster Recovery using RecoverPoint: 181 5 LAB22 - VMware vSphere Integration with VNX: 164 6 LAB17 - Introduction to the VMAX Family: 158 7 LAB07 - Easier and Faster VMware Backup and Recovery with EMC Avamar For the Storage Administrator: 142 8 LAB13 - VPLEX Metro with RecoverPoint: 3-site Solution for HighAvailability and Disaster Recovery: 140 9 LAB16 - Performance Analyzer for the VMAX Family: 122 10 LAB14 - Introduction to VMAX Cloud Edition: 99 11 LAB10 - Optimizing Backups for Oracle DBAs with EMC Data Domain and EMC Data Protection Advisor: 93 12 LAB24 - VNX/VNXe Storage Monitoring & Analytics For Your Business Needs: 80 13 LAB15 - Replication for the VMAX Family: 77 14 LAB05 - EMC NetWorker Backup and Recovery for Next Generation Microsoft Environments: 73 15 LAB08 - Automated Backup and Recovery for Your Software Defined Data Center with EMC Avamar: 68 16 LAB20 - EMC Isilon - Enterprise Ready with OneFS 7.0 Enhancements: 65 17 LAB19 - EMC Isilon - Compliance Mode Cluster Setup, Configuration, and Management Simplicity: 62 18 LAB25 - VNX Data Efficiency & Snapshots: 59 19 LAB04 - Atmos Cloud Storage: Mature, Robust and Ready to Rock: 57 20 LAB31 - Deploy and Operate Your Cloud with the VMware vCloud Suite: 56 21 LAB02 - VNX with AppSync: Simple Management, Advanced Protection: 45 22 LAB26 - VNXe Unisphere Administration & Snapshots: 43 23 LAB30 - Discover VMware Horizon Workspace: 39 24 LAB18 - Storage Provisioning and Monitoring with EMC Storage Integrator (ESI 2.1) and Microsoft System Center Operations Manager: 38 25 LAB09 - Taking Backup and Archiving To New Heights with EMC SourceOne and EMC Data Domain: 33 26 LAB12 - Achieving High Availability in SAP environments using VMware ESXi clusters and VPLEX: 31 27 LAB06 - Flexible and Efficient Backup and Recovery for Microsoft SQL Always-On Availability Groups using EMC NetWorker: 27 28 LAB27 - EMC VSPEX Virtualized Infrastructure for End User Computing: 27 29 LAB28 - Collaborative Big Data Analysis with the Greenplum Unified Analytics Platform: 21 30 LAB21 - RSA Cloud Security and Compliance: 16 31 LAB29 - Manage Your vCloud Suite Applications with VMware vFabric Application Director: 13   BTW – another “Tale of the tape”… Have you ever wondered why you feel so tired and spent after one of these conferences? It could be the late nights, and early mornings… Or it could be this:Fred Nix was following me around for chunks of the days – and this was from his pedometer. Total of 53.8mi accounted for. I estimate that I did another 10mi where he wasn’t with me, and he estimates another 10mi what wasn’t captured on thursday. Oh, and I did a couple of morning 5mi runs :-) That’s the equivalent of about 3 marathons :-) During each day – it was PACKED. Don’t get me wrong, but you end up a little cooked… Here’s one day, picked at random, and names blanked out to protect the innocent. It’s a solid block from 7am onwards. That all said – I had a BLAST – so many great big ideas, big announcements, and most of all – so many customers, partners, and colleagues packed into a great week!
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Lastest company news about Polyonics Introduces Ultra Thin High Dielectric Strength Double Coated (ESD)Tape 2021/11/23
Polyonics Introduces Ultra Thin High Dielectric Strength Double Coated (ESD)Tape
Polyonics manufacturers a variety of double coated polyimide and polyester (PET) tapes with high strength acrylic and silicone pressure sensitive adhesives (PSA). These new tapes address the growing trend of replacing traditional mechanical fasteners with double coated tapes in permanent assemblies. The Polyonics double coated tapes provide ultra thin, conformal bond lines plus have the added value of dielectric strengths up to 7.7kV/mil to help insulate and protect electrical and electronic assemblies.   Polyonics double coated tapes have proven effective in bonding and attachment applications in virtually all industries where both high thermal and electrical insulation is required. The tapes include a variety of liners that allow them to be easily die cut into complex shapes and auto applied if necessary. In addition, their ultra thin constructions help engineers save space and weight in their complex assemblies.   Flame Retardant Options The REACH and RoHS compliant tapes provide high temperature and chemical resistance. They are tear, puncture and abrasion resistant and have high tensile strengths and low elongation values. In addition, Polyonics double coated tapes provide halogen free flame retardant performance for applications where the prevention of the propagation of fire is required. These unique flame retardant tapes also include high dielectric strengths and are rigorously tested to the most stringent flame, smoke and toxicity standards including UL94, FAR 25.853 and BSS 7238/7239. The polyimide tapes are rated UL94 VTM0, the highest performance level.   All tape constructions are available with a variety of liners to best match each die cut process. They can also be configured with identical or dissimilar PSAs on each side of the tape to optimize the tapes adhesion to different surfaces. A low surface energy acrylic PSA is also available that provides strong adhesion to a wide range of plastic surfaces including polypropylene, polyethylene and TPO as well as powder coated surfaces.   Antistatic Options Antistatic and static dissipative performances are also available with Polyonics double coated tapes. The tapes have surface resistances of 10^5 to 10^9 Ohms, the heart of the static dissipative range. They also generate very low peel voltages (less than 100v) when their liners are removed. This significant reduction in electrostatic charge helps simplify the die cutting process plus minimizes charges being transferred to static sensitive devices (SSD) during the mounting process. In addition, once in place, the antistatic tapes help dissipate unwanted electrostatic charges to further protect SSD from potentially harmful ESD events.   Polyonics tapes thermally insulate components and devices up to 570F (300C) with acrylic PSA constructions and up to 1000F (500C) with silicone PSA versions. Various PSA thicknesses are available to best suit the surface roughness and configuration of the bond.   Electrical and thermal insulation, bonding attachment applications Insulating batteries (EV batteries, battery cells, battery packs, etc.) Insulating power supplies Attaching batteries to PCBs and battery management systems PCB attachments for exposure to high temperature wave flow solder and conformal coatings Bonding and insulating solar panels Attaching and insulating transformers, motors, windings, coils, etc. Attaching high or low temperature permanent seals and gaskets Bonding silicone foams Bonding electrical devices under vacuum requiring low out gassing Bonding and attaching smart phone and tablet electrical component, assemblies, etc. Protecting components and devices in strong and caustic chemical environments Bonding during vacuum coating, deposition, etc. Removable electrical test samples in high temperature and harsh environments Bonding plastic components in electrical, electronic devices and assemblies
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